Themis Computer Announces Themis
Slice Architecture
New platform is based upon Themis’ processor-independent,
switched computing architecture designed to meet the growing
thermal demands of high density/high performance, mission-critical
computing in hostile environments.
FREMONT, California -- April
4, 2006 --- Themis Computer announces its new Slice™ switched
computing initiative, designed to meet the escalating demands
for thermal and kinetic management, imposed by next generation
high density/high performance mission-critical computing.
A processor-independent architecture, the Themis “Slice” platform
allows users to mix, match, and manage SPARC® and x86
architectures, Solaris™, Windows®, and Linux® operating
systems, in combination with third party network servers,
storage
and switches.
Quorum™, Themis’ real-time, policy based resource
manager, insures contracted application Quality of Service
(QoS), for heterogeneous computing resources. Designed
for high density, high performance computing, the Themis
Slice Architecture is ideal for those who are looking for
highly available, horizontally scalable processing power
and lower life cycle cost of ownership.
Themis Slice is offered in air and liquid cooling variants
that provide thermal headroom to accommodate aggressive scaling
of commercial microprocessor core density, speed and power.
This open and modular design eases the burden of spiral technology
refresh, extending computing infrastructure investments for
complete lifecycle management.
“Themis Computer has achieved a breakthrough reduction
in Space, Weight and Power (SWAP), for mission-critical distributed
computing systems,” stated William E. Kehret, President
of Themis Computer. “By functionally disaggregating
commercial computing resources and housing them in a standardized
footprint, purpose-built enclosure, the Themis Slice Architecture
enables high compute densities with superior thermal and
kinetic management, without external shock and vibration
isolation,” Mr. Kehret added.
All Themis Slice elements are inherently rugged, have a
uniform mechanical footprint and a standard rack height (1-RU)
and depth (22"). Up to five Slice elements, including
a common Power Slice can be combined in a 5RU docking station,
or Subrack. The Subrack blind mates with connectors on the
Slice element, providing
power distribution, cable management and dripless couplings
for liquid cooling of the constituent Slice Subrack modules.
The Subrack allows liquid and air cooled Slices to be intermixed,
within a single docking station, providing blind mated dripless
couplers to cooling liquid manifolds in the docking station.
Subracks can be interconnected, using external switches,
to configure highly scalable grid computing systems.
Within the Subrack, Slice elements plug into an InfiniBand
high-speed, low latency serial switch fabric, so that clusters
of up to five Slice elements can be interconnected, without
external switches. Processor Slices interface with General
Purpose I/O (GPIO) Slices over a PCI-Express high-speed serial
fabric, also supported by the Subrack. Other Cluster elements
include Storage Slices and a four port Gig-E Target Channel
Adapter co-located in the Power Slice.
Distributed, Switched Computing Architecture: A single Slice
processing element can be organized as 2-16 way SMP nodes.
Up to four Processor Slices with up to 64 cores can be configured
in a single 5U Subrack. The cluster fabric, Internal to the
Subrack uses InfiniBand switches and links, for superior
(low) memory-to-memory transfer latency and scalable bandwidth.
Subrack clusters can be configured using either Gig-E or
InfiniBand. Themis Slice Subracks can be combined with IBM
or Sun Servers, in heterogeneous networks, using either networking
technology. At the Subrack level, Themis Slice technology
is a truly open architecture that offers superior SWAP and
environmental resiliency.
Themis Slice Price and Availability
Processor Slices are priced from $10,500. Processor Slice
configurations bundled with the subrack docking station and
power supplies, are priced from $26,000, in OEM quantities.
Please contact factory for evaluation units or for volume
order requirements.
See Themis’ new Quorum and Slice solutions
at LinuxWorld in Boston, MA April 4-6 in Booth #836 and
at Sea-Air-Space
2006 Expo in Washington, DC in Booth #4001 April 4-6.
About Themis Computer
Themis Computer is a leading developer and supplier of high
performance VME and Compact PCI single-board computers, as
well as systems for mission-critical telecommunications, military/aerospace,
and industrial embedded applications. Themis provides open
standards-based embedded computing platforms that support the
Solaris™, Linux®, and Windows® operating systems.
Themis' products incorporate features designed to ensure high
reliability
and
availability while reducing the risks of failure caused by
extreme environments. An ISO 9001 certified company, Themis
Computer practices Total Quality Management (TQM) in all areas
of its business, from engineering and manufacturing to customer
service. Themis Computer is headquartered in Fremont, California
and offers worldwide service and support. For more information
please visit www.themis.com or
email: info@themis.com.
For more information, please contact:
THEMIS COMPUTER US
William Hansen
47200 Bayside Parkway
Fremont, California 94538
Phone: (510) 252-0870
Fax: (510) 490-5529
Email: bhansen@themis.com
info@themis.com
Website: www.themis.com
In Europe contact:
THEMIS COMPUTER EUROPE
5, rue Irène Joliot-Curie
38320 Eybens, France
Phone: +33 (0) 476-14-77-86
Fax: +33 (0) 476-14-77-89
Email: europe@themis.com
###
Themis, the Themis logo, Rugged Enterprise
Server, Themis Slice, Themis Slice Processor Module, Themis
Slice Storage Module, Themis Slice Power Module, Themis Slice
Switch are trademarks or registered trademarks of Themis
Computer. Sun, Sun Microsystems, and Solaris are trademarks
or registered trademarks of Sun Microsystems, Inc. in the
United States and other countries. UltraSPARC and SPARC trademarks
are used under license and are trademarks or registered trademarks
of SPARC International, Inc. in the United States and other
countries. Products bearing SPARC trademarks are based upon
an architecture developed by Sun Microsystems, Inc. Windows
is a registered trademark of Microsoft Corporation. Linux
is a registered trademark of Linus Torvalds. All other trademarks
and registered trademarks are the property of their respective
owners.
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