Themis Announces its New CoolShell Bladed
Servers
Themis' innovative CoolShell Technology is
implemented in compact blade servers for use in demanding,
mission-critical systems
FREMONT, California -- November
17, 2009 -- Themis Computer® announces availability of
its innovative CoolShell Server Technology, which packages
high performance, multi-core processor-based server motherboards
with high-end, Graphics Processing Units (GPU), and industry
leading network connectivity in a bladed server configuration.
Themis' new blades use CoolShell technology to achieve high
server efficiency and lower Total Cost of Ownership (TCO).
The use of commercial "server" motherboards provides
users the most cost-effective, high compute density blade
solutions available. Themis' CoolShell blade systems are targeted
for applications that need a compact, lightweight solution
that must operate in demanding environments.
The principle barrier to higher compute density in modular
electronic packaging, is the cooling and mechanical stabilization
of high dissipation devices, most notably, the new breed of
multi-core microprocessors and high performance Graphics Processing
Units. Themis' CoolShell Technology provides a thermal and
kinetic management system that is stable and stiff, with a
conduction cooled Processor Module "shell", complete
with external air flow paths, heat exchangers and impeller
assembly - combined in a single, field replaceable unit (FRU).
Themis' CoolShell Bladed Servers combine unprecedented network
connectivity with up to eight optical/copper ports and a simplified
cabling system for easy installation and maintenance. Low
TCO is assured by modular, front panel only access for all
active components. Network and IO security is assured through
the use of independent controller channels, including both
Copper and Fiber Gigabit Ethernet NIC's. Themis' CoolShell
Technology provides kinetic management and thermal headroom
to accommodate aggressive scaling of commercial microprocessor
and GPU core density, speed and power.
"Working closely with our partners and customers, we
design and build rugged computing solutions that assure users
of high performance and reliability, even when deployed in
hostile operating environments," said William Kehret,
CEO of Themis Computer. "Our new CoolShell Technology
is the basis for the next generation of commercial blade servers,
providing industry leading compute density, superior scalability,
and lower total cost of ownership. We're seeing broad market
acceptance of this new technology and we expect to see CoolShell
blade servers systems deployed in a wide range of demanding
environments", Mr. Kehret added.
Themis' CoolShell CS-3U System
The CoolShell CS-3U is a modularly maintainable, commercial
blade server system that packs an extended complement of processing,
memory and IO, into a compact 3U, 17.75 inch deep rackmountable
CoolShell Subrack. All modules are replaceable from the front,
increasing uptime and significantly reducing maintenance costs.
All cable connections are on the FRU front panels, so no rear
access is required. The CoolShell CS-3U includes five replaceable
modules; a dual socket processor blade, an I/O module that
accommodates up to three double high PCI-Express controller
cards, media plus NIC module and two power supply modules.
The CoolShell CS-3U fits in a standard 19" rack.
Key CoolShell CS-3U features and specifications:
One or two Intel® Quad-Core Xeon® 5440
series CPUs
Up to 64GB memory
Three high performance dual headed Graphical
Processing Units
Up 1TB HDD (SATA drive) in Media Module and
five additional 2.5 inch SSD/HDDs in optional storage
expansion
Eight copper Gigabit Ethernet ports (RJ45) -
seven of which can be configured using optical-fiber ports
(SFP)
instead of copper
Environmentally robust
- withstands up to 30G, 25 ms shock and 1G rms
vibration (10-2000 Hz)
- meets MIL 901d, 810 and 167
- operates at up to 50° C temperature
- CPU electronics protected from dust and dirt
- light-weight construction
- reduced electromagnetic radiation emission
Linux®, Microsoft® Windows®, and
Solaris X86 operating system support
The CoolShell CS-3U processor Blade is based on an industry
standard, off-the-shelf motherboard. It includes two quad-core
Intel Xeon processors with up to 64GB of memory, two audio
ports and an external PCI-Express expansion port, accessible
from the front panel. The CoolShell CS-3U can be quickly updated
to the latest processor technology since it is based on off
the shelf components. New CoolShell CS-3U processor blades
can be available shortly after the latest technology commercial
motherboards are brought to market and can easily be upgraded
to the latest technology with plug and play FRU technology.
Since all FRU's contain their own cooling path and impellers,
higher power upgrades can be accommodated, without rebalancing chassis air flow.
The primary features and benefits of Themis' CoolShell blade
servers for users include:
High Compute Density 1RU Sized Blade Servers - enhances
SWaP and increases reliability in extended-environment operations.
Modular Maintainability - provides greater flexibility
for system refresh, on synchronous (e.g., cyclical basis)
or asynchronous (e.g., as required) schedules. Each module,
or FRU, can be refreshed independent of any other module in
the system, reducing the cost of service and upgrades, and
providing for lower TCO.
Mechanical Integrity - Designed to withstand 30G,
25ms shock events and vibration in excess of 1G rms.
Standard-Form Factor - CoolShell blades are 1RU high
and blind-mate connect into blade subracks that conform with
19" RETMA rack standards. CoolShell blades based on new
processors are backward compatible with earlier subracks and
CoolShell blades.
Shallow-Depth and Reduced Acoustic and Electromagnetic
Noise - CoolShell blade's integrated impeller assembly
enable a 17" inch blade depth and a shallow, 17.75"
chassis depth, with significantly lower noise than comparable
rackmount chassis and blade servers.
Composability - CS-3U modules can be configured, and
statically re-configured, depending upon the nature of its
deployment. In addition, Themis' innovative CoolShell System
can accept an alternate 1RU I/O Blade module, that can be
configured with up to 5TB of RAID Storage, a combination of
RAID and Graphics, or a suite of high performance graphics
accelerators for use as general purpose numeric array processing
engines.
Themis CoolShell CS-3U Availability
The CoolShell CS-3U is available now for evaluation, please
contact the factory for more information.
About Themis Computer
Themis Computer is a leading developer and supplier of high
performance board and system level products for mission-critical
telecommunications, military/aerospace, and industrial embedded
applications. Themis provides open standards-based embedded
computing platforms that support the Solaris, Linux®,
and Windows® operating systems. Themis' products incorporate
features designed to ensure high reliability and availability
while reducing the risks of failure caused by extreme environments.
An ISO 9001 certified company, Themis Computer practices Total
Quality Management (TQM) in all areas of its business, from
engineering and manufacturing to customer service. Themis
Computer is headquartered in Fremont, California and offers
worldwide service and support. For more information please
visit www.themis.com or
email: info@themis.com.
For more information,
please contact:
THEMIS COMPUTER US
William Hansen
47200 Bayside Parkway
Fremont, California 94538
Phone: (510) 252-0870
Fax: (510) 490-5529
Email: bhansen@themis.com
info@themis.com
Website: www.themis.com
In Europe contact:
THEMIS COMPUTER EUROPE
5, rue Irène Joliot-Curie
38320 Eybens, France
Phone: +33 (0) 476-14-77-86
Fax: +33 (0) 476-14-77-89
Contact: Themis Europe Information
###
Themis, the Themis logo, and CoolShell are
trademarks or registered trademarks of Themis Computer. All
other trademarks and registered trademarks are the property
of their respective owners.
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