Themis Computer

Themis understands Mission Critical Computing. From managing computing resources for financial services companies, to embedded computing for intelligence and defense, Themis provides the lowest total cost of ownership for your program.

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Themis Computer Announces TGA3D+ Graphics Accelerator Delivering Industry Leading Performance for Mission Critical Graphics

Innovative, new graphics adapter provides Sun XVR-500 performance and features including on-board 3-D geometry acceleration, hardware based texture mapping and high-resolution 24-bit 2-D support

FREMONT, California -- September 18, 2003 - Themis Themis Computer announced a new TGA3D+™ Graphics Adapter for its USPIIIi VMEbus computer and USPIIe-USB Single-Board-Computer solutions. Targeting embedded visual-simulation markets, Themis' TGA3D+ offers an affordable COTS solution for geotechnical, chart mapping, digital content creation, visualization and simulation applications. Themis' TGA3D+ is based on Sun Microsystems™ XVR-500 graphics technology, providing software compatibility with Solaris native graphics libraries and applications that run on Sun workstations and servers.

Themis' TGA3D+ Graphics Adapter provides an affordable, high-performance graphics solution for 3-D graphics applications that specifically require hardware-based, texture-mapping acceleration. Developed for use in military command and control systems, geotechnical, and simulation applications, the Themis TGA3D+ graphics board provides customers with XVR-500 compatibility and performance in a VMEbus form factor.

"We work closely with our customers to design and build high performance computing solutions for their demanding applications," stated William E. Kehret, president of Themis Computer. "Our TGA3D+ graphics adapter increases rendering speed performance. Important for dynamic command and control applications, this performance enhancement for our TGA3D+ series of graphics adapters extends the application range of our VMEbus computers."

Providing exceptional geometry and texture mapping performance, dedicated frame buffer memory support and a wide range of resolution options, the TGA3D+ is an ideal choice for demanding graphics applications, such as real-time volumetric displays.

TGA3D+ features and benefits include:

• 8.5 million triangles/second with up to 160 Mpixels/second texture fill rate: improves designer productivity by providing fast and realistic 3-D graphics, allowing users to capitalize on 3-D application functionality with a cost-effective graphics solution.
• 32 MB dedicated frame buffer memory supports Sun displays at resolutions up to 1920 x 1080 pixels (HDTV): allows users to display several application windows on-screen with little or no overlap, enabling the user to see more data at once.
• 16 MB dedicated, hardware-accelerated texture mapping memory: improves on-screen design quality and provides high-performance hardware-based texture mapping operations for fast visual feedback; helps ensure that there are no trade-offs between display resolutions, texture memory, and z-buffering depth.
• 3-D volumetric rendering: makes it possible to render internal textures of objects, a capability especially important in medical imaging (e.g., to view a 3-D CCAT scan) as well as oil and gas exploration.
• 32-bit Z-buffer: eliminates "poke-through" anomalies, in which objects appear to penetrate each other and flicker in and out as the image is moved.
• Stereoscopic video graphics support at 960 x 680 pixel, 1152 x 900 pixel, and 1280 x 800 pixel resolutions at up to 120-Hz refresh rates: improves the design visualization of complex 3-D relationships that may not be seen otherwise; reduces perceived flicker on screen, lowering occurrences of fatigue and eye strain.
• Rugged design for reliable operation in extreme environments - up to 40 G shock @ 20 ms and -5 to 55° C operating temperatures.

Themis' TGA3D+ is a graphics processing companion board for Themis' new USPIIII VMEbus computer and USPIIe-USB single-board-computer products. All graphics components, including the geometry processor, raster engine, PCI bridge and host interconnect are included on the single slot board. The TGA3D+ board also includes a 32/64-bit, 33Mhz PMC slot to provide additional PMC expansion options.

TGA3D+ specifications include:

• Graphics Memory - 3-D Frame Buffer Memory: 32MB
• 3-D Texture Memory: 16MB
• Onboard 64-bit/33MHz PMC slot
• Temperature Range (Operating): -5 - 55°C, (Non-Operating): -40 - 85 °C
• Humidity: 10 - 95% non-condensing
• Vibration (Operating): 0.5g from 4 - 50Hz, (Non-Operating) 1.0g from 4 - 50Hz
• Solaris 8 or later support
• Sun OpenGL® for Solaris 1.2.1 and later

Pricing and Availability

The Themis Computer TGA3D+ Graphics Adapter is priced at $3,500.00 (single quantity) and are available today.

About Themis Computer

Themis Computer is a leading developer and supplier of high performance VME and Compact PCI single-board computers, as well as systems based on ruggedized COTS motherboards and systems, for mission-critical telecommunications, military/aerospace, and industrial embedded applications. Themis provides open standards-based embedded computing platforms that support the Solaris™, Linux®, and Windows® NT operating systems. Themis' products incorporate features designed to ensure high reliability and availability while reducing the risks of failure caused by environmental extremes. An ISO 9001 certified company, Themis Computer practices Total Quality Management (TQM) in all areas of its business, from engineering and manufacturing to customer service. Themis Computer is headquartered in Fremont, California and offers worldwide service and support. For more information please visit www.themis.com or email: info@themis.com.

For more information, please contact:
THEMIS COMPUTER
William Hansen
3185 Laurelview Court
Fremont, California 94538
Phone: (510) 252-0870
Fax: (510) 490-5529
Email: bhansen@themis.com
info@themis.com
Website: www.themis.com

In Europe contact:
THEMIS COMPUTER EUROPE
5, rue Irène Joliot-Curie
38320 Eybens, France
Phone: +33 (0) 476-14-77-86
Fax: +33 (0) 476-14-77-89
Email: europe@themis.com

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Themis, the Themis logo, USPIIII, USPIIe-USB, and TGA3D+ are trademarks or registered trademarks of Themis Computer. Sun, Sun Microsystems, OpenGL, and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. All other trademarks are trademarks of their respective companies.