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Themis' new TPA-XMC™ is the first in a new family of PrPMC/PrXMC modules based on P.A. Semi's PA6T-1682M™ Power Architecture processor. The TPA-XMC provides powerful dual-core 64-bit processing, flexible high-speed I/O, and low power consumption in a small form factor.

The P.A. Semi PWRficient-1682M processor, based on the industry standard 64-bit implementation of the Power Architecture, redefines power, cost, and throughput efficiency in high-performance computing. The unique dual core, system-on-chip architecture, underpinned by 50 patents (filed and pending), delivers high performance at very low power consumption. The PWRficient-1682M includes the ENVOI™ I/O subsystem enabling a configurable mix of Gigabit Ethernet, 10 Gigabit Ethernet and PCI-express.

The TPA-XMC features the PWRficient-1682M on a PrPMC/PrXMC form-factor. It delivers higher 32-bit integer and floating point performance than existing PowerPC-based PMC modules, while consuming 30 percent less power. The TPA-XMC also provides the best 64-bit performance/power ratio in the industry. As energy costs continue to climb, Themis' energy efficient TPA-XMC is a practical upgrade for performance hungry, power constrained applications.

Themis' TPA-XMC is designed for a wide range of networking, wireless infrastructure, storage and military/aerospace systems that run PowerPC® applications. Eighteen user-configurable SERDES lanes are available on the TPA-XMC to serve a wide range of high-speed requirements. Serdes I/O options include Gigabit and 10 Gigabit Ethernet and PCI-Express. Since the PWRficient-1682M achieves dramatically better performance per watt than competing multigigahertz microprocessors, equipment manufacturers can use the TPA-XMC as the basis for products that run cool and efficiently, yet provide high performance.

The TPA-XMC provides support for many new or existing 32 or 64-bit PowerPC applications and Operating Support for Linux® and VxWorks®.

• P.A. Semi PA6T-1682M Dual Core 2.0GHz Processor
• 1 or 2GBytes of DDR2-400 ECC SDRAM Memory (soldered)
• 128Mbytes of OS Kernel NAND Flash Memory
• Real Time Clock with 256 Bytes NVRAM
• Dual Port 2MByte Shared L2 Cache
• DDR2 Memory Controller
• Built-In Computation and Transformation Offload Engines for:
  - Bulk Encryption
  - Cyclic Redundancy Checking (CRC)
  - Streaming XOR Generation
• Two 10 GB and Four SGMII Protocol Engines Provide:
  - Packet Processing, including Line-Rate Packet Filtering
  - VLAN Flow Control
  - TCP/IP Acceleration
• Estimated. Maximum Power: 25W, Estimated Typical Power: 15W
• 64-bit 133MHz PCI-X
• PCI-Express

Operating System Support
• Linux,
• VxWorks

Operational
• Auto detects Monarch or non-Monarch mode
• Configurable SERDES lanes (18) on XMC connectors

 

 

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The TPA-XMC embedded computer computer board includes these important design features:
• P.A.Semi PA6T-1682M dual core processor
• Configurable I/O
  - GiGE
  - 10GiGE
  - PCI Express

For configuration or pricing information, please contact factory at +1-510-252-0870, or in Europe at +1-33 (0) 476-14-77-86. Themis products are available to qualified organizations on United States GSA Schedule, contract number GS-35F-0553P, through Four Points Technology at +1-703-477-3990, or visit www.4points.com.
This new P.A. Semi Platform Processor is Power Architecture compatible, and runs new or existing 32 or 64-bit PowerPC code. This new device also features VMX (AltiVec™ compatible) SIMD Vector Processing Units and features industry leading processing performance per watt.

The P.A. Semi PA6T-1682M RISC Processor – which combines two 2GHz enhanced Power Architecture CPU Cores, two DDR2 memory controllers, 2MB of L2 cache, and a flexible I/O subsystem – is a versatile building block for high performance computing and embedded applications. PWRficient provides industry-leading performance per watt for multi-gigahertz computational applications and multi-gigabit throughput applications. This is the result of a ground-up design that optimizes power dissipation in all aspects of its novel system architecture which comprises an entire platform on a chip.
For more product information, please download the TPA-XMC datasheet, a 65 KB PDF document.








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