A principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization of high dissipation devices. Experts in thermal and kinetic management design, Themis engineers possess significant knowledge of the inner workings of the system and its environment to divide the system into modules and make them function together as a whole.
Mission-critical applications require equipment that can be quickly diagnosed, repaired and upgraded under extreme conditions. The open and modular design of Themis products eases the burden of spiral technology refresh and extends computing infrastructure investments for complete lifecycle management. Themis Computer board and system products provide the increased processing power and reliability necessary for demanding application environments, while achieving a net reduction in total cost of ownership.
Themis works closely with partners and customers to design and build rugged computing solutions that provide high performance, reliability, flexibility, and maintainability in demanding operating environments.
Applicable Themis Products