USPIIIi Board Level Computer

Themis’ USPIIIi™ is a high-performance family of single- and dual-processor SPARC®-based VMEbus computers for military, telecommunications, and embedded processing applications. Featuring a new system architecture with 1.28 GHz UltraSPARC IIIi processors and dual 160-MB/s ultra-SCSI ports, the USPIIIi is designed to provide users the industry’s best data bandwidth, 2-way scalability, and server class I/O.

The USPIIIi is a next generation computer suitable for demanding new applications or as an upgraded replacement of earlier USP-2 SMP VME products. The USPIIIi leverages Themis’ USPIIe-USB™ product family, and may be configured with either one or two UltraSPARC IIIi CPUs. The single-processor configuration consists of an I/O board and a CPU board assembly occupying two VME slots. A dual-processor configuration occupies three VME slots. Each USPIIIi CPU has a local SMP readable 4-GB memory, both processors of a dual-processor configuration can access up to 8-GB of memory.

Like its USP-2 predecessor, the USPIIIi provides excellent Oracle® graphics support. The optional Themis TGA3D+™ incorporates Oracle XVR-500 graphics technologies and is supported by the Solaris™ Operating Environment. An Ultra160 SCSI interface is used to support the increased bandwidth of today’s high-performance LVD SCSI devices; while automatic backward-compatibility modes protect your investment by assuring that earlier single-ended SCSI devices will continue to function properly.