RES Rack Mountable Servers and High Performance Computers

Themis RES servers and High Performance Computers (HPCs) provide high reliability and superior performance to ensure reliability and survivability in the most rugged places. Featuring leading-edge components that include Intel CPUs, NVIDIA Tesla M-class GPUs, and SuperMicro motherboards, Themis RES systems keep mission-critical applications available with superior resilience to environmental extremes that include shock, vibration, and temperature extremes. RES Systems provide maximum configuration flexibility with front and rear I/O models and compact 14, 17 or 20 inch depths. All aluminum chassis construction and use of advanced design techniques enable RES systems to be significantly lighter and smaller than traditional rack mountable servers.


Designed for thermal and kinetic management, and featuring the latest Four and Six-Core Xeon processors from Intel, the Themis family of XR3 Rugged Enterprise Servers (RES) provide high reliability and performance to keep mission-critical applications available in the most demanding environments. Click on any of the RES links to go to that product page.

Server Name Height CPU Sockets Chassis Depth I/O
RES-11XR3 1U 1 17 inches Rear
RES-12XR3 1U 2 17 or 20 inches Rear
RES-21XR3 2U 1 17 inches Rear
RES-22XR3 2U 2 17 or 20 inches Rear
RES-31XR3 3U 1 17 inches Rear
RES-32XR3 3U 2 17 or 20 inches Rear
RES-21XR3 FIO 2U 1 13 inches Front
RES-22XR3 FIO 2U 2 13 or 17 inches Front
RES-31XR3 FIO 3U 2 13 inches Front
RES-32XR3/FIO 3U 2 13 or 17 inches Front

 

Themis RES-NT1 High-Performance Computers (HPCs) combine the GPU computing performance of NVIDIA® TeslaTMM-Class computing modules and high-performance Intel Xeon processors with Themis robust thermal and kinetic design managemen to meet the demanding requirements of rugged environments.

Server Name Height GPU CPU Sockets Chassis Depth
RES-NT1-1U 1U M2050, M2070, or M2090 NVIDIA M-Class GPU 2 17 inches

 

Themis rugged enterprise servers feature:

  • Dual-redundant, hot-swappable power supplies
  • Dual-redundant DC power option
  • Operating shock: 3 Axis, 25G, 8 Hz – 2000Hz
  • Operating Vibration: 3.0 Grms, 8Hz – 2000Hz
  • Light weight, corrosion resistant, 14 to 20 inch (508mm-355mm) depth chassis
  • Multiple expansion slots, extensive high speed I/O, and multiple storage options
  • System expansion through the addition of commercially available, off the shelf networking cards, I/O, peripherals and other value-added options to meet current and future system requirements