RES-32XR3 FIO 3U, Two Socket, 13 or 17 Inch Depth Rack Mountable Server

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The Themis RES-32XR3 FIO three rack unit (3U) Dual-Processor server, with all I/O accessible from the front of the machine. Power supplies, disk drives, Gigabit Ethernet controllers and graphics port are also front panel accessible. The RES-32XR3 FIO features a shallow 13 inch (318.5 mm) or 17 inch (431.8 mm), chassis depth. Front access and shallow depth make the RES-32XR3 FIO and ideal solution for space constrained environments.

The RES-32XR3 FIO combines the robust design of the Rugged Enterprise Server (RES) family, with the latest 5500 and 5600 series Intel® Xeon® processors. The rugged RES-32XR3 FIO reflects Themis’ extensive expertise, designing high performance systems for use in demanding environments. This new system combines the Intel four and six core Xeon processors, with Themis’ advanced thermal and mechanical design techniques, to achieve I/O configuration flexibility and high reliability in high shock and vibration environments.

The RES-32XR3 FIO can be configured with one or two four- or six-core Intel Xeon processors. Featuring multiple expansion slots, extensive high speed I/O, and multiple storage options the RES-32XR3/FIO allows users versatile configurability and system expansion. The RES-22XR3 FIO is easily expanded through the addition of commercially available, off the shelf GPU and IO controllers, to meet current and planned system requirements.