The Themis RES-NT1 High-Performance Computer (HPC) combines the GPU computing performance of NVIDIA® TeslaTM M-Class computing modules, up to two Intel 5500 or 5600, fouror six core Xeon processors with up to 192 GB of memory, and Themis robust thermal and kinetic design management in a 1U form factor to meet the demanding requirements of rugged environments.
NVIDIA Tesla M-class computing modules are the world’s fastest parallel computing processors for high performance computing (HPC). Based on the Fermi architecture, M-class computing modules feature up to 665 gigaflops of double precisionperformance and one teraflop of single precision performance. M-class module are the first GPUs to have ECC memory that provides data reliability required in demanding environments. The M-Class high performance to power ratio in the RES-NT1-1U HPC brings new levels of computing power to applications outside the datacenter. The RES-NT1 HPC brings NVIDIA M-Class high-performance computing to environments constrained by space, weight, andpower (SWAP). The RES-NT1-1U HPC has a twenty inch (508mm) depth that enables it to fit in tight spaces. The system’s aluminum chassis is about half the weight of a standard steel chassis and operates reliably in very warm or cold environment to save power.
- NVIDIA® TeslaTM M-Class GPU Computing Modules
- M2050, M2070, M2090
- Intel® Xeon® Processors
- Intel 5500 or 5600, four or six core Xeon processors
- Mechanical Integrity
- Rack-optimized design for unique user requirements
- Designed for high reliability in harsh operating environments
- Specially coated aluminum for light weight and corrosion resistance
- Stainless steel reinforcement for strength and stiffness
- Modular design for easy upgrade and service
- Optional rack-mount slides
- Front-to-rear airflow direction
- Management and Operating System
- Windows® and Linux® application support
- IPMI v2.0 support
- Environmental Resiliency*
- Operating shock: 3 axis, 30G, 25ms
- Operating vibration: 2.0 Grms, 8 Hz to 2000 Hz
- Operating temperature: 0°C – Up to 50°C
- Humidity: up to 90% non-condensing
* Environmental specifications are configuration dependent
- Modular Maintainability
- Power supply options
- Single or redundant 110/220 VAC
- 18-36 VDC, 32 Amp
- 36-72 VDC, 18 Amp
- Power supply options
- MILSPEC
- MIL-STD-810G (Shock and Vibration)
| Processor and CPU | |
|---|---|
| Parameter | Description |
| GPU | M2050, M2070, or M2090 NVIDIA M-Class GPU |
| Processor | One or Two 5500 or 5600 Series Intel Xeon Processors |
| Memory | Up to 192 GB DDR3 ECC |
| Front Panel Access I/O | ||
|---|---|---|
| I/O | Quantity | Access |
| Status LEDs | 2 | Front panel |
| Gigabit Ethernet ports (RJ45) | 2 | Front panel |
| USB 2.0 ports | 2 | Front panel |
| RS-232 serial ports (DB9) | 1 | Front panel |
| Power switch | 1 | Front panel |
| Power connector | 1 or 2 | Front panel |
| VGA port (graphics) | 1 | Front panel |
| Environmental* | ||
|---|---|---|
| PARAMETER | NON-OPERATING | OPERATING |
| Temperature Range | -40° C – 70° C | 0°C – to 50°C |
| Humidity (non-condensing) | 5% to 95% | 8% to 90% |
| Shock | 3 axis, 35G, 25ms | 3 axis, 35G, 25ms |
| Vibration (10-2000Hz) | 3.0 Grms, 8 Hz to 2000 Hz | 3.0 Grms, 8 Hz to 2000 Hz |
* Environmental specifications are configuration dependent.
| Mechanical | |
|---|---|
| Parameter | Description |
| Dimensions | Height: 1RU or 1.75 inches (44.45 mm) Width: 17.06 inches (433.3 mm) Depth: 20 inches (508 mm) |
| Chassis Features | |
| Coated aluminum for light weight and corrosion resistance | |
| Stainless steel in selected areas to add strength and stiffness | |
| Modular design for easy upgrade and service | |
| Optional rack-mount slides | |
| Airflow direction: front to rear | |
| Modular Maintainability | |
|---|---|
| Parameter | Description |
| Power Supply Options | Single or redundant 110/220 VAC, 750 Watt (50/60Hz, 400Hz) 18-36 VDC, 32 Amp 36-72 VDC, 18 Amp |

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