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Themis RES-HD Modular Servers

Compose Your Solution

Available in a 2U (four bay) or 3U (six bay) chassis, Themis RES-HD servers integrate the latest Intel® Xeon® Scalable processors and provide maximum versatility with over six configurable “plug and pull” compute, storage, networking, expansion, or management modules.  Modules can be mixed and matched – with each combination creating a new type of functionality.

Front I/O Configurations:

Eliminate Rip and Replace

Each chassis has a typical 15-year lifespan and accomodates current, previous, and future generation RES HD modules—eliminating the need to rip and replace during technology upgrades and streamlining deployment. With lightweight modules, RES HD simplifies logistics, cuts costs associated with spares, and enables modules to be repurposed across different applications.

Rugged Navy and Army Servers with long term sustainability

Modular Composability

Long Term Sustainability

Themis RES-HD and HDslim chassis accommodate previous, current and future RES HD modules. The newest generation RES XR6 HD modules integrate the latest Intel Xeon Scalable processors to deliver superior workload-optimized performance and hardware-enhanced security in a smaller footprint. Designed for mission critical applications outside the data center, all modules meet or exceed military specifications—incorporating advanced thermal and mechanical design features to provide enhanced reliability with superior resiliency to shock, vibration, and temperature extremes.

XR6 RES HD Module Specifications (Front I/O)

Available Modules

  • Compute (HDC): dual-socket processor module
  • Storage (HDS): dual-socket processor module with 4 (HDS4) or 8 (HDS8) storage drives
  • Storage Expansion (HDSE): storage expansion module (currently available in rear I/O chassis configurations)
  • PCIe Expansion (HDP): dual-socket processor module with multiple PCIe options
  • Networking (HDN) switches: 1Gbps (HDN1), 40Gbps, 56Gbps IB (HDN40, HDN56) and 100Gbps (HDN100) managed switches
  • Resource Manager (HDRM): resource management module
  • Fabric Extender(HDFE): HD Global Fabric Extender

Mechanical Specifications

Height: 1.6” (41mm, 1 slot) or height: 3.35” (85mm, 2 slot) 7 inches (177mm)
Width: 20.3 inches (515mm)
Typical Weight: 9.8lbs

XR6 High Density Compute (HDC)

Occupies one RES HD chassis slot

HDC Compute Module for Rugged Front IO Servers
System
Parameter Qty Description
Processor 1 Intel® Xeon® Scalable Processor up to 22 cores, 44 threads**
Memory Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
Disk on Module 2 Up to 128GB per DOM
Input/Output
Parameter Qty Access
USB 3.0 Ports 2 Front
VGA 1 Front
Ethernet Ports (RJ45) 4 Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
Serial Port 1 Front (optional)

XR6 High Density Storage (HDS) Module Options

There are multiple storage module options, with common specifications listed below. Secure storage options are also available. A configured 2U or HDslim server can deliver four Intel Xeon Scalable Processors and 720TB of storage with 24 direct attached HDD/SSD drives. HDS4 and HDS8 modules occupy two RES HD chassis slots each.

System
Parameter Qty Description
Processor 1 Intel® Xeon® Scalable Processor up to 22 cores, 44 threads**
Memory Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
Disk on Module 2 Up to 128GB per DOM
Input/Output
Parameter Qty Access
USB 3.0 Ports 2 Front
VGA 1 Front
Ethernet Ports (RJ45) 4 Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
Serial Port 1 Front (optional)

High Density Storage (HDS4)

Mil Specification High Density Storage Module with four front access drives
Storage: 4 front-access SATA, SAS3 or U.2 storage drives for up to 120TB of storage
Expansion: up to 2 PCiE 3.0×16 + 1 PCie 3.0×8 low/highprofile, half length cards

High Density Storage (HDS8)

Rugged Modular High Density Storage Module with 8 drives
Storage: 8 SATA or SAS3 drives for up to 240TB of storage
Expansion: up to 2 PCiE 3.0×16 low profile, half length cards

XR6 High Density PCIe Expansion (HDP) Module

The latest XR6 HDP module accommodates the latest NVIDIA® Quadro or Tesla graphics card for supercomputing and virtualization applications. Each configured HDP module can integrate one GPGPU. Other PCIe expansion options are available. Each HDP module occupies two RES HD chassis slots.

Rugged PCIe expansion module that accomodates NVIDIA TESLA and QUADRO
System
Parameter Qty Description
Processor 1 Intel® Xeon® Scalable Processor up to 22 cores, 44 threads**
Memory Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
Disk on Module 2 Up to 128GB per DOM
PCIe Expansion up to 5 Options

  1. 1 double wide PCiE 3.0×16 (eg. TESLA GPGPU) 2 PCIe 3.0×16, low profile, half length cards
  2. 1 PCIe 3.0 x 8, 1 PCIe 3.0, low profile, half length cards
  3. 2 PCIe 3.0×16 low profile, half length cards & 2 PCIe 3.0×8 full height, full length cards
Input/Output
Parameter Qty Access
USB 3.0 Ports 2 Front
VGA 1 Front
Ethernet Ports (RJ45) 4 Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
Serial Port 1 Front (optional)

High Density Networking (HDN) – Managed Switch Modules

There are multiple managed switch modules available for RES HD servers: 1Gbps (HDN1), 40Gbps, 56Gbps IB (HDN40, HDN56) and 100Gbps (HDN100) managed switches. HDN switch modules occupy one RES HD chassis slot.

Rugged Modular Mellanox Switches Mercury Systems

1GBe Ethernet Switch (HDN1)

Switch
Parameter Qty Description
Switch Ethernet Ports 16 1GbE (RJ45)
Other Ports (RJ45) 2 (1) Serial (1) Ethernet Management
Network Layer 2/3
Features
Routing IPv4/IPv6: IP Multicast, VLANs, IETF, IEEE, DSL Forum
Quality of Service (QoS) IEEE 802.1p priority tagging, DSCP, traffic queues
Management Ethernet (http, telnet, SNMP) and RS232 (CLI)

Functionality:
48Gbps performance switching capacity
35.71 Mpps maximum forwarding rate
8K entries MAC address table size
3.5Mbits Packet Buffer Forwarding mode: store and forward
Supports half/full duplex operation at 10/100Mbps
Supports port auto-negotiation

10GbE, 40GbE, 56GbE IB (HDN40, HDN56)

Switch
Parameter Qty Description
Switch Ethernet Ports 12 56Gb IB, 40GbE, 10GbE VPI switched ports
Other Ports (RJ45) 2 Serial + Ethernet Management
Features
Throughput Non-blocking bidirectional, 1.344 Tb/s
Latency 200ns (56Gb IB), 220ns (40GbE), 270ns (10GbE)
Network Layer 2/3 (10GbE, 40GbE) feature set

56Gb IB Features
CLI or SNMP Management, IBTA 1.21 and 1.3 Compliancy
9 Virtual Lanes (8 data + 1 management)
256 to 4Kbyte MTU, 4x48K entry linear forwarding data base
On-board SM for fabrics up to 648 nodes
Management ports: 100/1000 Ethernet, RS232 port over DB9, miniUSB

100GbE Switch (HDN100)

The HDN100 switch is currently only available for HDslim chassis configurations.

Switch
Parameter Qty Description
Switch Ethernet Ports 22 18 SFP+/SFP28 10/25GbE + 4 splittable QSFP+/QSFP28 40/100GbE ports
Other Ports (RJ45) 2 Serial + Ethernet Management
Features
Throughput Non-blocking bidirectional, 1.7 Tb/s
Latency 300ns for 100GbE, consistent latency

Layer 2/3 Features
10/25/40/50/56/100GbE
Multi chassis LAG (MLAG) 802.1W rapid spanning tree 802.1Q
multiple STP 802.3 ad Link Aggregation (LAG) & LACP
Jumbo frames (9216 Bytes)
IPv4 & IPv6 route maps including BGP4
OSPFv2 BFD (BGP, OSPF, static routes)
DHCPv4/v6 Relay Router port, int VLAN
NULL interface for routing

Network Virtualization
VXLAN Hardware VTEP-L2 GW
Integration with VMware NSX, Openstack and more

Software Defined Storage (SDN):
Openflow 1.3 (hybrid, supported controllers)

Security:
US APL Department of Defense Certification
System secure mode: FIPS 140-2 Compliance
Access Control Lists (ACLs L2-L4 & user defined)
802.1X Port based access control
SSH server restrict mode – NIST 800-181A
CoPP (IP filter), port isolation, storm control

High Density Resource Management (HDRM)

Occupies one RES HD chassis slot

Rugged Modular Mellanox Switches Mercury Systems
System
Parameter Qty Description
Processor 1 Intel i5-5300U vPro Processor
Server Management IPMI 21.0, Zabbix, Web Based Interface
Managed IPMI Ports 16 1GbE (RJ45)
Other Ports 2 1 Management Console, 1 Serial
Compliancy IEEE 802.3, 802.3u, 802.3ab IEEE 802.3x flow control support

High Density Fabric Extender (HDFE)

Designed to alleviate the challenges associated with transferring and accessing data across geo-diverse locations, the HDFE offers predictable, distance-independent performance with the HDFE module and MaxDX™ software. Access or transfer large amounts of data up to 75x faster than TCP/IP at 10G/30,000km.

System
Parameter Qty Description
Software Bay Microsystem’s MaxDX™
Processor 2 Intel Xeon E5-2600 v3/v4 series with 20 cores
Switching 120Gbps non-blocking switch capacity
Interface Two 4X FDR InfiniBand QSFP+ ports;
Two 40GE QSFP+ ports; Six 1/10GE SFP+ ports
Fabric Reach Round Trip Time (RTT) of 2500ms @10Gbps, 625ms @ 40G

Benefits:

  • Streamlined distributed workflows with predictable data access and sharing
  • Accelerated workloads and reduced application run times
  • Operational efficiency with maximum  bandwidth usage and minimal data replication
  • Capital preservation by leveraging existing infrastructure
  • Minimal downtime and seamless business continuity with predictable data copy, back-up and disaster recovery for
  • Easy to understand intuitive software with a web-based management interface

Themis RES HD Chassis Specifications

Parameter Description
Dimensions Height: 4 chassis slot, 2U or 3.5 inches (88.9 mm), 6 chassis slot, 3U or 5.25 inches (133.35 mm)
Width: 17.06 inches (433.3 mm)
Depth: 20 inches (508 mm)
Power supply options Single or redundant 110/220 VAC (1200W)
Single or redundant 28 VDC (500W, 750W DC)
Weight (typical)* 2U chassis: 40 pounds
3U chassis: 60 pounds
Parameter Non-Operating Operating
Temperature Range -40° C – 70° C 0°C – to 55°C
Extended Temperature Range* -40° C – 70° C -15° C – 55° C *
Humidity (non-condensing) 5% to 95% 8% to 95%
Shock 3 axis, 35g, 25ms 3 axis, 35g, 25ms
Vibration 4.76 Grms, 5Hz to 2000Hz (SSD) 4.76 Grms, 5Hz to 2000Hz (SSD)
Safety EN60000 EN60000
RFI/EMI EN 55032, EN 55024, EN 61000 EN 55032, EN 55024, EN 61000
Compliance CE Mark CE Mark
MIL Spec MIL-STD 810F and MIL-STD 461 MIL-STD 810F and MIL-STD 461

* Extended temperature range is dependent on system configuration/components and application thermal profile.

Front I/O Configurations: