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RES-NT2-1U High-Performance Computer

Accelerate your mission with GPGPU Computing

For rugged GPGPU computing applications, Mercury’s EnterpriseSeries of processing solutions includes the Themis RES-NT2 1U high performance computer (HPC) product range. RES-NT2 combines one NVIDIA® TESLA GPU accelerators, two Intel® E5 2600 Xeon® processors, and up to 1 TB ECC DDR4 memory in a resilient, lightweight, and shallow 1U chassis. The RES-NT2 performs in harsh environments where optimized SWaP is critical.

RES-NT2 supports all NVIDIA GPGPU Accelerators including M10, M60, P4, P40, K80, P100, and V100.
RES-NT2 supports all NVIDIA GPGPU Accelerators including M10, M60, P4, P40, K80, P100, and V100.

The RES-NT2-1RU HPC is designed with superior resilience to environmental extremes that include shock, vibration, and temperature extremes. This expertise in thermal and kinetic management design keeps mission-critical applications available, improves life-cycle management, and reduces the total cost of ownership. The system’s aluminum chassis is typically half the weight of a standard steel chassis and operates reliably in hot or cold environments to save power.

GRID™ Virtualization

Fully compatible with popular virtualization technologies, the RES-NT2 with NVIDIA GRID GPGPUs enables multiple virtual machines to have direct access to high performance graphic processing such as 3D visualization, visual simulation, and virtual reality.

TESLA™ Supercomputing

Designed for artificial intelligence, deep learning, and simulation applications, the RES-NT2 with NVIDIA TESLA GPGPUs delivers record speeds for video and signal processing, simulation, modeling, and computational physics. With teraflops of single and double precision performance, NVIDIA TESLA computing accelerators are the world’s fastest and most efficient high-performance computing companion processors.


Parameter Description
Processor Up to two E5-2600 v3/v4 Series Intel® Xeon® processors with up to twenty cores per socket
Memory Up to 1 TB DDR4 ECC
GPU Accelerators (1) double slot GPGPU
Network 1GbaseT Ethernet (up to 100GbE Ethernet available)

Management and Operating System

Parameter Description
OS Windows® and Linux® application support
Management Interface IPMI v2.0 support

On Board Expansion

Parameter Description
Expansion slots (2) (1) PCIe x16 GPU slot (1) PCIe x8 (in a x16 slot)


I/O Quantity Access
Status LEDs 2 Front
GigE Port (RJ45) 2 Rear
USB 3.0 ports 2 Rear
IPMI 2.0 port 1 Rear
Power connector 2 Rear
Power switch 1 Front
VGA Port (graphics) 1 Rear

Modular Maintainability

Parameter Description
Hot Pluggable Drives (2) Front Access drives
Power Supply Options Single or redundant 1200W 110/220 VAC


Parameter Non-Operating Operating
Temperature Range -40° C – 70° C 0°C – to 50°C
Extended Temperature Range -40° C – 70°C -15°C – to 65°C**
Humidity (non-condensing) 5% to 95% 8% to 95%*
Shock 3 axis, 35g, 25 ms 3 axis, 35g, 25 ms
Vibration (10-2000Hz) 4.76 Grms, 5Hz to 2000Hz (SSD) 4.76 Grms, 5Hz to 2000Hz (SSD)

* Extended temperature range and some environmental specifications are dependent on the system configuration, components, and application thermal profile. Please contact TMS for information specific to your desired configuration requirements.


Parameter Description
Dimensions Height: 1U or 1.75 inches (44.45 mm)
Width: 17.06 inches (433.3 mm)
Depth: 25 inches (635 mm)
Weight 24 pounds (10.9 kg)
Chassis Features Coated aluminum for light weight and corrosion resistance
Stainless steel in selected areas to add strength and stiffness
Modular design for easy upgrade and service
Optional rack-mount slides and dust filter
Airflow direction: front to rear

* Weights are provided for typical configurations. Weight may vary depending on configuration.


Parameter Description
MIL-STD-810G Shock and vibration