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RES-NT2-1U High-Performance Computer

Accelerate your mission with GPGPU Computing

Meant for Rugged GPGPU Computing, the Themis RES-NT2 1U High-Performance Computer (HPC) combines one NVIDIA® TESLA GPU accelerators, two Intel® E5 2600 Xeon® processors, and up to 1 TB ECC DDR4 memory in a resilient, lightweight, and shallow 1U chassis. The RES-NT2 performs in harsh environments where optimized Size, Weight, and Power (SWAP) is critical.

NVIDIA GPGPU Accelerators 2017
RES-NT2 supports all NVIDIA GPGPU Accelerators including M10, M60, P4, P40, K80, and P100.

The RES-NT2-1RU HPC is designed with superior resilience to environmental extremes that include shock, vibration, and temperature extremes. This expertise in thermal and kinetic management design keeps mission-critical applications available, improves life-cycle management, and reduces the total cost of ownership. The system’s aluminum chassis is typically half the weight of a standard steel chassis and operates reliably in hot or cold environments to save power.

GRID™ Virtualization

Fully compatible with popular virtualization technologies, the RES-NT2 with NVIDIA® GRID™ GPGPUs enables multiple virtual machines to have direct access to high performance graphic processing such as 3D visualization, visual simulation, and virtual reality.

TESLA™ Supercomputing

Designed for artificial intelligience, deep learning, and simulation applications, the RES-NT2 with NVIDIA® TESLA™ GPGPUs delivers record speeds for video and signal processing, simulation, modeling, and computational physics. With teraflops of single and double precision performance, NVIDIA® TESLA™ Computing Accelerators are the world’s fastest and most efficient high-performance computing companion processors.

System

Parameter Description
Processor Up to two E5-2600 v3/v4 Series Intel® Xeon® processors with up to twenty cores per socket
Memory Up to 1 TB DDR4 ECC
GPU Accelerators (1) double slot GPGPU
Network 1GbaseT Ethernet (up to 100GbE Ethernet available)

Management and Operating System

Parameter Description
OS Windows® and Linux® application support
Management Interface IPMI v2.0 support

On Board Expansion

Parameter Description
Expansion slots (2) (1) PCIe x16 GPU slot (1) PCIe x8 (in a x16 slot)

I/O*

I/O Quantity Access
Status LEDs 2 Front
Gigabit Ethernet Port (RJ45) 2 Rear
USB 3.0 ports 2 Rear
IPMI 2.0 port 1 Rear
Power connector 2 Rear
Power switch 1 Front
VGA Port (graphics) 1 Rear

Modular Maintainability

Parameter Description
Hot Pluggable Drives (2) Front Access drives
Power Supply Options Single or redundant 1200W 110/220 VAC

Environmental*

Parameter Non-Operating Operating
Temperature Range -40° C – 70° C 0°C – to 50°C
Extended Temperature Range -40° C – 70°C -15°C – to 65°C**
Humidity (non-condensing) 5% to 95% 8% to 95%*
Shock 3 axis, 35g, 25 ms 3 axis, 35g, 25 ms
Vibration (10-2000Hz) 4.76 Grms, 5Hz to 2000Hz (SSD) 4.76 Grms, 5Hz to 2000Hz (SSD)

* Extended temperature range and some environmental specifications are dependent on the system configuration, components, and application thermal profile. Please contact Themis for information specific to your desired configuration requirements.

Mechanical

Parameter Description
Dimensions Height: 1U or 1.75 inches (44.45 mm)
Width: 17.06 inches (433.3 mm)
Depth: 25 inches (635 mm)
Weight 24 pounds (10.9 kg)
Chassis Features Coated aluminum for light weight and corrosion resistance
Stainless steel in selected areas to add strength and stiffness
Modular design for easy upgrade and service
Optional rack-mount slides and dust filter
Airflow direction: front to rear

* Weights are provided for typical configurations. Weight may vary depending on configuration.

MILSPEC

Parameter Description
MIL-STD-810G Shock and vibration