Accelerate your mission with GPGPU Computing
For rugged GPGPU computing applications, Mercury’s EnterpriseSeries of processing solutions includes the Themis RES-NT2 1U high performance computer (HPC) product range. RES-NT2 combines one NVIDIA® TESLA GPU accelerators, two Intel® E5 2600 Xeon® processors, and up to 1 TB ECC DDR4 memory in a resilient, lightweight, and shallow 1U chassis. The RES-NT2 performs in harsh environments where optimized SWaP is critical.
The RES-NT2-1RU HPC is designed with superior resilience to environmental extremes that include shock, vibration, and temperature extremes. This expertise in thermal and kinetic management design keeps mission-critical applications available, improves life-cycle management, and reduces the total cost of ownership. The system’s aluminum chassis is typically half the weight of a standard steel chassis and operates reliably in hot or cold environments to save power.
Fully compatible with popular virtualization technologies, the RES-NT2 with NVIDIA GRID GPGPUs enables multiple virtual machines to have direct access to high performance graphic processing such as 3D visualization, visual simulation, and virtual reality.
Designed for artificial intelligence, deep learning, and simulation applications, the RES-NT2 with NVIDIA TESLA GPGPUs delivers record speeds for video and signal processing, simulation, modeling, and computational physics. With teraflops of single and double precision performance, NVIDIA TESLA computing accelerators are the world’s fastest and most efficient high-performance computing companion processors.
|Processor||Up to two E5-2600 v3/v4 Series Intel® Xeon® processors with up to twenty cores per socket|
|Memory||Up to 1 TB DDR4 ECC|
|GPU Accelerators||(1) double slot GPGPU|
|Network||1GbaseT Ethernet (up to 100GbE Ethernet available)|
Management and Operating System
|OS||Windows® and Linux® application support|
|Management Interface||IPMI v2.0 support|
On Board Expansion
|Expansion slots (2)||(1) PCIe x16 GPU slot (1) PCIe x8 (in a x16 slot)|
|GigE Port (RJ45)||2||Rear|
|USB 3.0 ports||2||Rear|
|IPMI 2.0 port||1||Rear|
|VGA Port (graphics)||1||Rear|
|Hot Pluggable Drives||(2) Front Access drives|
|Power Supply Options||Single or redundant 1200W 110/220 VAC|
|Temperature Range||-40° C – 70° C||0°C – to 50°C|
|Extended Temperature Range||-40° C – 70°C||-15°C – to 65°C**|
|Humidity (non-condensing)||5% to 95%||8% to 95%*|
|Shock||3 axis, 35g, 25 ms||3 axis, 35g, 25 ms|
|Vibration (10-2000Hz)||4.76 Grms, 5Hz to 2000Hz (SSD)||4.76 Grms, 5Hz to 2000Hz (SSD)|
* Extended temperature range and some environmental specifications are dependent on the system configuration, components, and application thermal profile. Please contact TMS for information specific to your desired configuration requirements.
|Dimensions||Height: 1U or 1.75 inches (44.45 mm)
Width: 17.06 inches (433.3 mm)
Depth: 25 inches (635 mm)
|Weight||24 pounds (10.9 kg)|
|Chassis Features||Coated aluminum for light weight and corrosion resistance
Stainless steel in selected areas to add strength and stiffness
Modular design for easy upgrade and service
Optional rack-mount slides and dust filter
Airflow direction: front to rear
* Weights are provided for typical configurations. Weight may vary depending on configuration.
|MIL-STD-810G||Shock and vibration|