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RES-NT2 3U High-Performance Computer (HPC)

Accelerate your mission with GPGPU computing

RES-NT2 3U High-Performance Computer (HPC) combines up to four NVIDIA® TESLA GPU accelerators, two Intel® E5 2600 Xeon® processors, and up to 1 TB ECC DDR4 memory in a ruggedized 3RU form factor to meet the requirements of demanding environments where SWaP are severely limited.

RES-NT2 supports all NVIDIA GPGPU Accelerators including M10, M60, P4, P40, K80, P100, and V100.
RES-NT2 supports all NVIDIA GPGPU Accelerators including M10, M60, P4, P40, K80, P100, and V100.

GRID™ Virtualization

RES-NT2 3U provides full compatibility with popular virtualization technologies and brings graphics-accelerated virtual workstations, desktops, and applications to mission-critical military, industrial, and commercial applications. NVIDIA GRID technology offers the ability to offload graphics processing from the CPU to the GPU in virtualized environments. This enables the data center manager to deliver true PC graphics-rich experiences to more virtual users for the first time.

TESLA™ Supercomputing

NVIDIA TESLA GPU accelerators use innovative technologies to boost performance and power efficiency and deliver record application speeds for processing, simulations, modeling, image, video and signal processing, computational finance, computational physics, CAE, CFD, and data analytics. With teraflops of single and double precision performance, NVIDIA Pascal GPU computing accelerators are the world’s fastest and most efficient high-performance computing companion processors.

System

Parameter Description
Processor Up to two E5-2600 v3/v4 Series Intel® Xeon® processors with up to twenty cores per socket
Memory Up to 1 TB DDR4 ECC 2400MHz; 16x DIMM slots
GPU Accelerators Up to (4) double slot GPGPUs
Network 1GbaseT Ethernet (up to 100GbE Ethernet available)

Management and Operating System

Parameter Description
OS Windows® and Linux® application support
Management Interface IPMI v2.0 support

On Board Expansion

Parameter Description
Expansion slots (7) (4) PCIe x16 GPU Slots, (2) PCIe x16 and (1) PCIe x8

I/O*

I/O Quantity Access
Status LEDs 2 Front
GigE Port (RJ45) 2 Rear
USB ports (2) USB 3.0, (2) USB 2.0 Rear
IPMI 2.0 port 1 Rear
Power connector 2 Rear
Power switch 1 Front
VGA Port (graphics) 1 Rear

Modular Maintainability

Parameter Description
Hot Pluggable Drives (8) Front Access drives
Removable Fans 3
Power Supply Options Up to 3
Power 1200W 110/220 VAC OR 800W 28 VDC

Environmental*

Parameter Non-Operating Operating
Temperature Range -40° C – 70° C 0°C – to 50°C
Extended Temperature Range -40° C – 70°C -15°C – to 65°C**
Humidity (non-condensing) 5% to 95% 8% to 95%*
Shock 3 axis, 35g, 25 ms 3 axis, 35g, 25 ms
Vibration (10-2000Hz) 4.76 Grms, 5Hz to 2000Hz (SSD) 4.76 Grms, 5Hz to 2000Hz (SSD)

* Extended temperature range and some environmental specifications are dependent on the system configuration, components, and application thermal profile. Please contact TMS for information specific to your desired configuration requirements.

Mechanical

Parameter Description
Dimensions Height: 3U or 5.25 inches (133.35 mm)
Width: 17.06 inches (433.3 mm)
Depth: 20 inches (508 mm)
Weight 45 pounds (20.4 kg)
Chassis Features Coated aluminum for light weight and corrosion resistance
Stainless steel in selected areas to add strength and stiffness
Modular design for easy upgrade and service
Optional rack-mount slides and dust filter
Airflow direction: front to rear

* Weights are provided for typical configurations. Weight may vary depending on configuration.

MILSPEC

Parameter Description
MIL-STD-810G Shock and vibration